Circuit board
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Technical Consulting

Cirflex has experience in Electronic Interconnection and Packaging in particular Printed Circuit Board and Flexible Circuit design, manufacture and application.

This includes:

  1. Product Design (Flexible Circuits, PCB, HDI interconnect and packaging)
  2. Technology Transfer (HDI circuit fabrication techniques)
  3. Industrial / Production Engineering (including factory design / process equipment design)
  4. Environmental / Quality systems


Flexible circuit technology:

Experience includes:

  1. Ultra fine line resolution,
  2. Complex circuit structures and assembly,

Roll-to-roll manufacture of flexible circuits   Vacuum sputter deposition of copper as part of our semi-additive technology  
Roll-to-roll manufacture of flexible circuits   Vacuum sputter deposition of copper as part of our semi-additive technology  
  1. Roll-to-roll additive and semi-additive processing.
  2. Adhesiveless flex base materials



Cirflex Technology
Email: info@cirflex.com
Tel: +44 (0)1245 443193